Mr Chai Chan Wah was the General Manager of UAT, overseeing the wafer bumping operations, a position he has held since September 2014 till March 2025. Mr Chai holds a Bachelor of Science (Hons) Degree majoring in Physics from the National University of Malaysia.

With a rich and dynamic career spanning over 36 years in the semiconductor industry, Mr Chai brings wealth of experience to his role. Before assuming the position of General Manager at UAT, he held a significant role of Vice President-Corporate Technology Development at Unisem Ipoh. In this capacity, Mr Chai played a pivotal role in driving the development of new products and processes within Unisem group related to semiconductor packaging. His career with Unisem began in 1993, initially leading the process engineering team and later heading the development team in 2006.

Mr Chai was a committee member of International Electronics Manufacturing Technology Conference from year 2010 to 2024, a flag ship conference of IEEE EPS (Electronic Packaging Society) Malaysia. Prior to joining Unisem in 1993, Mr Chai spent 5 years as Senior Process Engineer at Carsem (M) Sdn Bhd specialising in hermetic and plastic packaging.